ADVANCED HDI PCB FABRICATION & ASSEMBLY

HDI PCBs are the circuit boards with higher wire density than standard criterias. HDI PCBs appear thinner lines and spaces, smaller vias and higher connection pad density, which are commonly used for high spacing and precision required devices and system cards.

FEATURES OF OUR HDI PCBs

• Blind and/or buried vias

• Min. Line Width/Space: 0.05/0.05mm

• Via-in-pad

• Through vias from surface to surface

• 20 µm circuit geometries

• 30 µm dielectric layers

• 50 µm laser vias

• 125 µm bump pitch processing

• Surface Finish: ENIG/OSP/HASL/Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/Carbon Ink

BENEFITS OF HDI PCBs MANUFACTURING WITH INNO

• Shorter PCB manufacturing time-to-market and enhanced machine performance for Flip Chip, BGA, MCM, SIP technologies.

• Ultra thin cores, fine line geometries and alternative via methods for improved thermal transfer for thermal PCBs.

• In compliance with 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.

• Allows reducing the lead times by combining the manufacturing capabilities with a profound understanding of high speed digital and high frequency RF package requirements.

• Increases the area for PCB designer to place electronical components and also enhances faster signal transmission and reduced signal loss.

• Our high HDI PCB boards have the technology-driving capabilities to bring applications in a large number of industries including but not limited to semiconductor test equipment, military weapons, medical, and aerospace.
  
  

  Feature	Capability
  Number of Layers	4-30 layer
  Quality Grade	IPC 6012 Class 2,IPC 6012 Class 3
  Material	Tg 140°C FR4,Tg 150°C FR4,Tg 170°C FR4 ,Special material
  Thickness	0.4-6.0mm
  Min Track/Spacing	Inner layer: Part 2 / 2mil, overall 3 / 3mil (H/H OZ base copper) Outer layer: Part 2.5/2.5mil, overall 3 / 3mil(H/H OZ base copper)
  Min Hole Size	0.15mm-0.3mm
  Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
  Silkscreen	White, Black,Yellow,Blue
  Surface Finish	Immersion gold,OSP,Hard gold,Immersion Silver
  Finished Copper	0.5-13oz
  Build time	5-10 days
  Lead time	2-3 days