PCB Assembly
Detailed Terms for PCB Assembly
| Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
| Various sizes like 1206,0805,0603 components SMT technology | |
| ICT(In Circuit Test),FCT(Functional Circuit Test) technology | |
| PCB Assembly With CE,FCC,Rohs Approval | |
| Nitrogen gas reflow soldering technology for SMT | |
| High Standard SMT&Solder Assembly Line | |
| High density interconnected board placement technology capacity | |
| Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication |
| Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly | |
| To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders. | |
| Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate | |
| OEM/ODM/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA |
| PCBA and enclosure design | |
| Components sourcing and purchasing | |
| Quick prototyping | |
| Plastic injection molding | |
| Metal sheet stamping | |
| Final assembly | |
| Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) | |
| Custom clearance for material importing and product exporting | |
| Other PCB Assembly Equipments | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 |
| Reflow Oven: FolunGwin FL-RX860 | |
| Wave Soldering Machine: FolunGwin ADS300 | |
| Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service | |
| Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |
Quality Control
As an ISO9001 certified PCB assembly manufacturer, we strictly follow each process standard to ensure details are perfectly handled.
Inspection & Testing Equipment | ||||
| Name | AOI inspection | X-Ray inspection | Aging testing | Function testing |
| Part number | JTA-320-M | AX7200 | / | / |
| Picture |  |  |  | |
| Specification | JTA-320-M | Magnification: 250X Resolution ratio: 75/110Lp/cm Focus size: 5μm | design as per projects | design as per projects |
| Quantity | 4 | 1 | as per order qty and requests | as per order qty and requests |
| Test Purpose | 100% inspection for every board; To check if any components missing, damage, deviation or opposite assemble. | Inspection BGAs assembling if any fake assemble or shortcuts. Ensure all BAG balls assembled perfectly. | We can make 4 hours-12 hours aging testing to make sure all boards working status. Before shipment. | Simple function test for boards. Can test radio, video, display, warning function… |
Packing
We have clear labels stick outside all cartons with part number, quantity, weight and date information. From prototypes order to big volume productions order, every shipment was treated carefully with labels. The cartons gross weight normally controlled as 15-17KG which ensure the merchandise safety and avoid transportation damage.
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