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Multilayer PCBs – Technical specification

FeatureTechnical specification
Number of layers2 ~ 52 layers
MaterialsFR4, ( 94V-0, Tg 135, Tg 150, Tg 170 )
Solder Mask ColorGreen, Blue, Black,White, Red, Yellow, Purple, Pink, Grey
CharactersWhite, Yellow, Black, etc.
Board Thickness0.2mm - 6.0mm
Copper weights (finished)0.5oz - 6.0oz
Minimum Trace/Space0.07mm / 0.07mm
Minimum dimensions5mm x 5mm;
Maximum dimensions610mm x 600mm
Minimum mechanical drill (PTH)0.15mm
Minimum laser drill (blind/micro hole)0.1mm
Surface finished

HASL - Hot air solder leveling
Lead - free HASL - RoHS
ENIG - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
Golden finger - RoHS
OSP - RoHS

E-Testing100% E-Test , Flying Probe Test & Fixture Test
IPC StandardIPC 600 Class 2 & Class 3

Multilayer PCB

With the continuous innovation of electronic technology and the continuous improvement of the requirements for electronic equipment in some industries such as computers, medical treatment, and aviation, printed circuit boards are developing in the direction of smaller volume, lighter weight, and increased density. Single and double-sided printed boards can no longer meet the demand, so it is necessary to consider using more layers and higher assembly density multilayer circuit boards.


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