Multilayer Heavy copper 6OZ immersion gold PCB

Heavy copper does not have a set definition per IPC. However, the industry generally accepts the definition to be the use of 3 ounce copper or higher in inner and/or outer layers of a printed circuit or power distribution board.
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产品详情

Layer1~30 Layers
MaterialFR4, CEM1, CEM3, Hight TG, Rogers, F4B, Taconic, FR1, FR2, 94V0, Aluminum
Production Capacity30000 ㎡/months
Board shapeRectangular, Round, Slots, Cutouts, Complex Irregular
Board cuttingShear, V-Score, Tab-Routed, Counter Sunk
Board thickness0.2~8.0mm, Flex 0.1-0.25mm
Copper weight0.5oZ~12oZ
Solder MaskDouble-sided Green LPI, Red, White, Yellow, Blue, Black, Purple etc.Solder mask
Silk screenDouble-Sided or Single-Sided in White, Yellow, Black etc
Min line width/space0.08mm/3mil
Max board dimensions25.6inch*43.3inch or 650mm*1100mm
Min drill hole diameter0.1mm
Min Laser Drill hole diameter0.075mm
Surface finishHASL, ENIG, Immersion Tin, Immersion Silver, OSP,ENEPIG etc
Board thickness toleranc± 10%
Min slot width0.12",3.0mm,or 120mils
V-score depth20-25% of board thickness
PTH Wall Thickness>0.025mm
PTH Hole Dia Tolerance±0.076mm
Non PTH Hole Dia Tolerance±0.05mm
Hole Position Deviation±0.076mm
Sink holesYes
Quality StandardIPC-A600F/MIL-STD-105D
Design file formatGerber RS-274X, 274D, Eagle and AutoCAD'S DXF,DWG

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